Automatic solder paste dispenser

How to control the dispensing amount of the automatic solder paste machine

How to control the dispensing amount of the automatic solder paste machine
The amount of glue dispensed by the solder paste dispensing machine should be based on work experience. The diameter of the glue points should be half of the distance between the solder pads, and the diameter of the glue points after pasting should be 1.5 times the diameter of the glue points. This ensures that there is sufficient glue to bond the components while avoiding excessive glue contamination of the solder pads.
The amount of glue dispensed by the solder paste dispensing machine is determined by the rotation time of the screw pump. In practice, the rotation time of the pump should be selected based on production conditions (room temperature, adhesive viscosity, etc.). The following process defects are prone to occur in production:
To solve problems such as substandard adhesive spot size, wire drawing, adhesive impregnated solder pads, poor curing strength, and easy peeling, it is necessary to study various technical process parameters as a whole to find solutions.
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