Fluid dispensing technology is a key technology in microelectronic packaging, which can construct and form points, lines, surfaces (coatings), and various shapes, and is widely used in chip fixation, packaging flip flops, and chip coating. This technology accurately distributes fluids in a controlled manner, transferring ideal sized fluids (such as flux, conductive adhesives, epoxy resins, and adhesives) to suitable locations on workpieces (chips, electronic components, etc.) to achieve mechanical or electrical connections between components. This technology requires good operational performance, high dispensing speed, and consistency and accuracy of the dispensing system. At present, both domestically and internationally, research is being conducted on dispensing equipment that can adapt to various fluid materials and have better flexibility, enabling it to accurately control fluid flow and the position of adhesive points to obtain uniform adhesive points, while achieving accurate positioning of adhesive points to meet the needs of the development of the electronic packaging industry.
With the development of the packaging industry, dispensing technology has gradually shifted from contact dispensing to non-contact (spray) dispensing. In the past few decades, significant progress has been made in the research of contact needle dispensing, which can achieve accurate positioning of adhesive points and obtain adhesive points with a diameter as small as 100 micrometers. However, its dispensing speed is slow and the consistency of adhesive points is poor; The emergence of non-contact spray dispensing has greatly improved the speed of fluid material distribution, high spraying frequency, and uniform and consistent adhesive points.
Characteristics of Piezoelectric Injection Valve
1. Adopting non-contact spray dispensing to eliminate Z-axis movement and achieve higher production efficiency. Adopting a new piezoelectric driving device and modular design of nozzles and firing pins, it is easy to replace, clean, and maintain. It can spray in a gap of 0.08mm and can also spray glue on uneven workpiece surfaces. The spraying amount can be accurate to 0.1nl, and the consistency accuracy of the spraying adhesive point can reach 99%.
2. Exquisite structure design, small overall size, and convenient installation. The use of non-contact spray dispensing can achieve higher yield and efficiency than traditional contact dispensing. With independent wetted and replaceable components, it can achieve fast and convenient maintenance and adapt to strict application requirements. Extremely high repeatability and precision ensure consistency in dispensing and improve production efficiency.
3. Non contact spray dispensing eliminates Z-axis movement and achieves higher production efficiency.
4. High precision dispensing.
5. Exquisite modular design.
6. Convenient and fast cleaning.