Skip to product information
1 of 5

Automated Potting of Electronics

Automated Potting of Electronics

Regular price ¥45,000.00
Regular price ¥35,000.00 Sale price ¥45,000.00
Sale Sold out
样式
  • This machine is tailored for small amounts of glue, trace amounts or refill
  • widely used in the back section of production line, laboratories, universities, chemical plants and other sites
  • The equipment has the characteristics of small size, flexible and convenient space, etc. It is suitable for customers with small rubber requirements
  • Overall dimensions (length * width * height) : 550mm*500mm*600mm
  • Power input: AC220V (170~264V)
  • Power output: DC24V 14.6A
  • Air source pressure: 0.4-0.6Mpa.
  • Temperature: 0-40℃、
  • can achieve continuous/single quantitative glue spitting
  • The barrel is equipped with a liquid level sensor, which automatically alarms the shortage of materials
  • Static or dynamic mixer can be used to force mixing, so that the mixing effect is more uniform
  • Proportional adjustment Simple operation allows the operator to easily adjust the required ratio
  • The spewing speed and spewing amount can be set, and the amount of spewing glue is accurate and stable without dripping
  • A variety of optional functions, flexible to adapt to a variety of different glue filling process needs
  • This model can be selected 10L, 5L, 2L cylinder, can be matched with any stroke three-axis manipulator and SCARA multi-joint robot hand
  • Heading
  • Heading
  • Heading
View full details

Contact form